dc.contributor.author | O’Mullane, Samuel | |
dc.contributor.author | Keller, Nick | |
dc.contributor.author | Diebold, Alain C. | |
dc.creator | | |
dc.date.accessioned | 2017-04-12T13:37:41Z | |
dc.date.available | 2017-04-12T13:37:41Z | |
dc.date.issued | 2016 | |
dc.identifier.issn | 1932-5150 | |
dc.identifier.uri | http://hdl.handle.net/1951/69068 | |
dc.description.abstract | Using rigorous coupled wave analysis (RCWA) and finite element method (FEM) simulations together,
many interesting ellipsometric measurements can be investigated. This work specifically focuses on simulating copper grating structures that are plasmonically active. Looking at near-field images and Mueller matrix spectra, understanding of physical phenomena is possible. A general strategy for combatting convergence difficulties in RCWA simulations is proposed and applied. The example used is a copper cross-grating structure with known slow convergence. Baseline simulations on simple samples are provided for comparison and determination of FEM accuracy. | en_US |
dc.description.sponsorship | SUNY Polytechnic Institute, College of Nanoscale Science and Engineering, 257 Fuller Road, Albany, New York 12203, United States
Nanometrics, Inc., 1550 Buckeye Drive, Milpitas, California 95035, United States | en_US |
dc.language.iso | en_US | en_US |
dc.publisher | Journal of Micro/Nanolithography, MEMS and MOEMS | en_US |
dc.subject | rigorous coupled wave analysis | en_US |
dc.subject | finite element method | en_US |
dc.subject | simulation | en_US |
dc.subject | ellipsometric measurement | en_US |
dc.subject | near-field image | en_US |
dc.subject | Mueller matrix | en_US |
dc.subject | convergence | en_US |
dc.subject | grating structure | en_US |
dc.subject | copper | en_US |
dc.subject | cross-grating structure | en_US |
dc.subject | FEM accuracy | en_US |
dc.title | Modeling ellipsometric measurement of three-dimensional structures with rigorous coupled wave analysis and finite element method simulations | en_US |
dc.title.alternative | Journal of Micro/Nanolithography, MEMS and MOEMS | en_US |
dc.type | Article | en_US |