Browsing SUNY Polytechnic Institute by Author "Wajda, Cory S."

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Atomic layer deposited ultrathin metal nitride barrier layers for ruthenium interconnect applications

Dey, Sunal; Yu, Kai-Hung; Consiglio, Steven; Tapily, Kandabara; Hakamata, Takahiro; Wajda, Cory S.; Leusink, Gert J.; Jordan-Sweet, Jean; Lavoie, Christian; Muir, David; Moreno, Beatriz; Diebold, Alain C. (Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, 2017)

Resistance capacitance time delay in Cu interconnects is becoming a significant factor requiring further performance improvements in future nanoelectronic devices. Choice of alternate interconnect materials, for example, ...
Role of Ge and Si substrates in higher-k tetragonal phase formation and interfacial properties in cyclical atomic layer deposition-anneal Hf1-xZrxO2/Al2O3 thin film stacks

Dey, Sonal; Tapily, Kandabara; Consiglio, Steven; Clark, Robert D.; Wajda, Cory S.; Leusink, Gert J.; Woll, Arthur R.; Diebold, Alain C. (Journal of Applied Physics, 2016)

Using a five-step atomic layer deposition (ALD)-anneal (DADA) process, with 20 ALD cycles of metalorganic precursors followed by 40 s of rapid thermal annealing at 1073 K, we have developed highly crystalline Hf1-xZrxO2 ...