dc.contributor.advisor | Salman, Emre | en |
dc.contributor.author | Satheesh, Suhas M. | |
dc.contributor.other | Department of Electrical Engineering. | en |
dc.date.accessioned | 2012-10-10T16:17:28Z | |
dc.date.available | 2012-10-10T16:17:28Z | |
dc.date.issued | 2012-05-01 | |
dc.date.submitted | May-12 | en |
dc.identifier.uri | http://hdl.handle.net/1951/57605 | |
dc.description.abstract | Three primary techniques for manufacturing through silicon vias (TSVs), viafirst,
via-middle, and via-last, have been analyzed and compared to distribute power
in a three-dimensional (3-D) processor-memory system with nine planes. Due to
distinct fabrication techniques, these TSV technologies require significantly different
design constraints, as investigated in this work. A valid design space that
satisfies the peak power supply noise while minimizing area overhead is identified
for each technology. It is demonstrated that the area overhead of a power distribution
network with via-first TSVs is approximately 9% as compared to less than
2% in via-middle and via-last technologies. Despite this drawback, a via-first based
power network is typically overdamped and the issue of resonance is alleviated. A
via-last based power network, however, exhibits a relatively low damping factor and
the peak noise is highly sensitive to number of TSVs and decoupling capacitance. | en_US |
dc.description.sponsorship | Stony Brook University Libraries.
Department of Electrical Engineering.
Lawrence Martin (Dean of Graduate School). | en_US |
dc.format | Electronic Resource. | en |
dc.language.iso | en_US | en_US |
dc.publisher | The Graduate School, Stony Brook University: Stony Brook, NY. | en_US |
dc.subject | | en_US |
dc.subject.lcsh | | en |
dc.subject.other | 3-D IC, Decoupling capacitor, Peak noise, Power delivery, Processor-memory, TSV | en |
dc.title | Power Distribution in 3-D Processor-Memory Stacks | en_US |
dc.type | Thesis | en_US |
dc.description.advisor | Advisor(S): Dr. Emre Salman
Committee Member(s): Dr. Milutin Stanacevic. | en |