DSpace Repository

Browsing Stony Brook University by Subject "3-D IC, Decoupling capacitor, Peak noise, Power delivery, Processor-memory, TSV"

Browsing Stony Brook University by Subject "3-D IC, Decoupling capacitor, Peak noise, Power delivery, Processor-memory, TSV"

Sort by: Order: Results:

  • Satheesh, Suhas M. (The Graduate School, Stony Brook University: Stony Brook, NY., 2012-05-01)
    Three primary techniques for manufacturing through silicon vias (TSVs), viafirst, via-middle, and via-last, have been analyzed and compared to distribute power in a three-dimensional (3-D) processor-memory system with ...
  • Satheesh, Suhas Mysore (The Graduate School, Stony Brook University: Stony Brook, NY., 1-May-12)
    Three primary techniques for manufacturing through silicon vias (TSVs), via-first, via-middle, and via-last, have been analyzed and compared to distribute power in a three-dimensional (3-D) processor-memory system with ...

Search DSpace


Browse

My Account